硅设计链扩展低功耗设计协作

Silicon Design Chain Extends Low-Power Design Collaboration

要解决纳米设计中遇到的问题,如信号完整性、动态和漏电流功耗,以及可制造性等,需要设计链上各个环节的紧密合作。基于此考虑,AppliedMaterial、ARM、Cadence和TSMC公司组成了硅设计链产业协作组织(SDC),帮助用户解决他们在采用先进工艺进行设计制造时遇到的问题。

Recognizing the need to cooperate more closely on nanometer design issues, such as signal integrity, dynamic and leakage power consumption, andmanufacturability, industry leaders Applied Material, ARM, Cadence and TSMC formed the Silicon Design Chain Initiative. Combining their expertise,these companies have established a charter to drive programs designed to address the top issues facing their customers as they adopt advanced processtechnologies.