粉体表面化学镀的研究进展

Development of electroless plating on powders

对粉体进行化学镀具有重要的学术意义和广阔的应用前景。介绍了粉体化学镀的优点及特点,敏化活化一步法和敏化活化两步法两种预处理工艺及各自的优缺点,并较全面地对目前国内外正在研究的微米级、纳米级粉体化学镀进行了评述和讨论。

It has important academic significance and wide application to electroless plating on powders in this paper. The characters and advantage of electroless plating on powders were discussed. The pretreatment of powders, includes activation and sensitization of two or one step, their advantage and disadvantage were also compared. The paper also reviewed and discussed the developments of electroless plating on micro-size, nanometer powders surface both at home and abroad.