粘接界面的损伤研究

Investigation into Damage for the Adhesive Interface

把粘接界面本构模型应用到商用的各向异性导电胶粘接的试件中,并用此模型计算试件的90°剥离的开裂.通过对粘接界面模型的修正,在原界面模型的基础上,增加了界面损伤因子χ,根据实验数据分别给出了温度循环损伤因子和高温高湿损伤因子计算公式.损伤因子不但能改变粘接的最大应力值,也能改变粘接界面开裂的位移.有损伤因子的界面本构能够描述温度循环和高温高湿试验后试件粘结强度的变化,此界面损伤模型的计算结果与实验结果吻合较好.

The cohesive zone type interface model is used in the ACF bonding samples, and the interface model can calculate 90° peel delimination. The constitutive equation for the interface is modified by introduction a damage factor. The thermal damage factor and humidity damage factor can be derived from the experiment data. The interfacial model with damage factor can change the maximal peel stress and the delimination length. The calculation result of the interfacial model with damage factor accorded well with the experiment of the 90° peeling.