DSC法研究聚异氰酸酯／环氧树脂胶粘剂的固化反应动力学及固化工艺

Study on curing reaction kinetics and curing technics of poly-isocyanate/epoxy resin adhesive by DSC

采用差示扫描量热法(DSC)研究了聚异氰酸酯／环氧树脂的固化过程,研究了不同配比对固化反应的影晌,固化度与固化温度的关系,计算了固化反应表观活化能和反应级数,确定了聚异瓤酸酯／环氧树脂胶粘剂的固化工艺。结果表明:胶粘剂中固化剂的含量对环氧树脂的固化反应过程有显著的影响,随着聚异氰酸酯的增加,固化放热量增加。当聚异氰酸酯的含量达到1．2份时,固化反应放热量达到最大值;不同升温速率下,体系固化温度有很大差异,随着升温速率的提高,固化温度增加。通过动力学计算得到体系最佳固化温度为108℃,固化时间为6-8h,固化体系的活化能为43．31kJ／mol,反应级数为1．17。

The curing process and curing technics of poly-isocyanate/epoxy resin were investigated by the DSC technology. The influence of curing agent amount on curing reaction and the relationship of curing degree and curing temperature were considered. The results show that the curing agent amount has a great influence on curing reaction heat which increases with increasing polyurethane amount first,then reaches a peak at 1.2. The relationship of curing temperature and heating rate was also investigated,from this,the activation energy and the order of curing reaction are gained with kinetics catculation,43.31kJ/mol and 1.17 respectively. Base on the kinetics results,curing technics was discussed：the best curing temperature is 108℃ and the curing times under this temperature is 6-8h.