摘要
The preparation of fine copper powders by chemical reduction method was investigated. The reaction of [Cu（NH3）4]2^＋ complex with hydrazine hydrate gives spherical monodispersed fine copper powders. The spherical copper powder with a uniform size of 3.5 ± 0.5 μtm was processed to obtain flake copper powder having a uniform size of 8-10 μm, excellent dispersibility and uniform shape. The spherical copper powder of 2.5 ±0.3 μm in size, flake copper, glass frit and vehicle were mixed to prepare copper paste, which was fired in 910-920℃ to obtain BME-MLCC （base metal multilayer ceramic capacitor） with a dense surface of end termination, high adhesion and qualified electrical behavior. Polarized light photo and SEM were employed to observe the copper end termination of BME-MLCC. The rough interface from the interracial reaction between glass and chip gives high adhesion.
The preparation of fine copper powders by chemical reduction method was investigated. The reaction of [Cu（NH3）4]2^＋ complex with hydrazine hydrate gives spherical monodispersed fine copper powders. The spherical copper powder with a uniform size of 3.5 ± 0.5 μtm was processed to obtain flake copper powder having a uniform size of 8-10 μm, excellent dispersibility and uniform shape. The spherical copper powder of 2.5 ±0.3 μm in size, flake copper, glass frit and vehicle were mixed to prepare copper paste, which was fired in 910-920℃ to obtain BME-MLCC （base metal multilayer ceramic capacitor） with a dense surface of end termination, high adhesion and qualified electrical behavior. Polarized light photo and SEM were employed to observe the copper end termination of BME-MLCC. The rough interface from the interracial reaction between glass and chip gives high adhesion.
