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Temperature effect in thermosonic wire bonding 被引量:2

Temperature effect in thermosonic wire bonding
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摘要 The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes. The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes.
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2006年第3期618-622,共5页 Transactions of Nonferrous Metals Society of China
基金 Projects(50390064 50575230) supported by the National Natural Science Foundation of China Project(2003CB736202) supported by the National Basic Research Program of China
关键词 集成电路 倒装式接合 引线接合法 粘合温度 粘结强度 超声能 thermosonic wire bonding flip chip bonding bonding temperature bonding strength ultrasonic energy
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