摘要
The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes.
The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes.
出处
《中国有色金属学会会刊:英文版》
EI
CSCD
2006年第3期618-622,共5页
Transactions of Nonferrous Metals Society of China
基金
Projects(50390064
50575230) supported by the National Natural Science Foundation of China
Project(2003CB736202) supported by the National Basic Research Program of China
关键词
集成电路
倒装式接合
引线接合法
粘合温度
粘结强度
超声能
thermosonic wire bonding
flip chip bonding
bonding temperature
bonding strength
ultrasonic energy