超声键合换能器的研究——回顾与展望

Development and prospect of ultrasonic bonding transducer

回顾了超声键合用换能器的发展状况,特别是在我国的研究状况。对超声键合用换能器的研究方法进行了总结,例如等效网络法、直接解振动与波动方程法、有限元法。不少单位已经编制了等效网络法的计算程序,可以迅速准确地得到细长和简单换能器结构的频率特性和导纳曲线;利用有限元软件可以计算复杂结构的换能器特性,是当今设计仿真的有效工具。论文结合当前微电子、集成芯片对超声键合的大量需求,展望了超声键合换能器的发展前景。除高频换能器和小体积的换能器需要进一步研究外,性能更加稳定和优良的换能器依然是研究的热点。

This paper reviews the development of ultrasonic bonding transducer, specially the development in China. Methods used in the study of ultrasonic bonding transducer are summarized, such as equivalent network, direct solution of the vibration and wave equations, and finite element method （FEM）. Programs for the network method have been developed by many researchers, which can be used to calculate frequency and admittance characteristics of long and thin transducers rapidly and accurately. FEM is an effective tool for design and calculation of transducers with complicated structure. A design example is given for a 120 kHz transducer using the above two methods. The range of Qm factor of bonding transducers is shown, which is important for bonding quality. With a comprehensive view on the tremendous need for ultrasonic bonding of micro-electric integrated chips, the prospect of ultrasonic bonding transducer is shown. Stability and reliability of bonding transducers will be a research hotspot.