摘要
采用1286电化学接口及旋转圆盘电极测定了硫酸铜镀液阴极极化曲线和循环伏安曲线。结果表明,Cl-有增大阴极极化的作用。同时还测定了含TDY添加剂镀液的深镀能力和分散能力,其分散能力为92%,深镀能力为41.3mm,镀液寿命达334A·h/L。镀层光亮,结晶细致均匀。
Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.Throwing power and covering power of the plating solution are also measured. The results show that addition of Cl- may increase cathodic polarization, throwing power of the plating solution containing TDY additive is 92%, covering power is 41.3mm, bath life is above 334A·h/L and crystal of the bright copper deposit is fine and uniform.
出处
《电镀与涂饰》
CAS
CSCD
1996年第3期4-8,共5页
Electroplating & Finishing
关键词
镀铜
硫酸铜
印刷电路板
电镀
copper plating, sulfate copper, printed circuit board