“电子封装和PCB组装的材料、工艺和可靠性”学术讲座

前言：电子产品日益小型化、高功耗和环保要求对电子封装和PCB组装以及材料供应商提出了许多挑战。在这次讲座中我们将详细讲解电子元件封装和PCB组装技术以及工艺，并了解组装材料和工艺对最终产品质量和可靠性的影响。例举并讨论组装材料，例如焊料合金、焊膏、助焊剂和芯片粘接材料的主要特性，及评估认证这些材料和工艺优化的方法。对HoHS和无铅加工技术和可靠性进行深入的探讨。进一步，我们将回顾发生在电子元器件和PCB组装中的主要失效机理。我们将以实际案例来讲解产品可靠性评估，寿命预测，HALT／ESS试验方法。

The drive to ever-increased miniaturization, high power dissipation, and more environment-friendly electronics products, presents many challenges not only to the OEMs, but also to packaging houses and PCB assemblers, as well as to material suppliers. In this lecture we will examine the critical characteristics of assembly materials, such as solder alloys, pastes, fluxes, and die attach materials, by detailed study of component packaging and PCB assembly technologies and processes, and by understanding the effects of these assembly materials and processes on the final product reliability. Methodologies for assembly materials evaluation, qualification, and process optimization are presented and discussed. Furthermore, we will review major failure mechanisms operative in electronics components and PCB assemblies. Practical methods and tools for product reliability assessment, life prediction, HALT/ESS testing are also presented with actual case studies and examples.