摘要
采用真空冶炼法制备了低熔点的Ga-Ag-Sn液态合金,分析了Ga含量与液态合金熔点的关系。利用X射线衍射仪、电子扫描显微镜和能谱等多手段对Ga95.0Ag0.15Sn合金与Cu基体的结合界面进行了分析。结果表明,Ga95.0Ag0.15Sn液态合金能与无氧铜基体发生互扩散,并形成致密且与基体结合良好的Ga-Cu界面层而能起到真空修复作用,界面层的相组成为Cu9Ga4相,Cu41Sn11相和α-(Cu,Sn)相。
The low melting point Ga-Ag-Sn liquid state alloy prepared by vacuum mehing method was studied. The interface between Ga95.0 Ag0.15 Sn alloy and Cu substrate was characterized by XRD, SEM and EDS. The results indicate that Ga95.0Ag0.15 Sn liquidstate alloy enables mutual diffuse with copper and forms a compacted gallium-copper interphase which is made up of Cu9Ga4 phase, Cu41Sn11 phase and α-（Cu, Sn） phase, and has a good combination with copper substrate thus has the vacuum repair function.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2006年第3期310-312,共3页
Chinese Journal of Rare Metals
基金
国防科工委基金资助项目(MKPT-04-237)
江苏南京工业大学引进人才科研基金项目(51303021)
