摘要
文中介绍了一种用于测试系统的分析方法,通过测试系统分析了解生产过程中使用的设备的变差,并对不合格的设备进行分析、改进,提高集成电路测试数据的真实性和准确性；减少产品在测试、检验过程中误判的可能性。
A Measurement system analysis （ M.S.A ） method is described. The variance of the test system used in the production can be obtained through M.S.A, and the accuracy of the IC test data can be improved through the analysis and improve the incompetent system, In this way , we can reduce the possibility of misjudgment in IC testing and inspection.
出处
《电子与封装》
2006年第7期12-15,31,共5页
Electronics & Packaging
