摘要
Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures has been demonstrated. Stop-action images of a target have been obtained with computer microvision, microscopic interferometry, and stroboscopic illuminator. It can be developed for measuring the in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures. A new algorithm of sub-pixel step length correlation template matching is proposed to extract the in-plane displacement from vision images. Hariharan five-step phase-shift interferometry algorithm and unwrapping algorithms are adopted to measure the out-of-plane motions. It is demonstrated that the system can measure the motions of solder wetting in surface mount technology(SMT).
Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures has been demonstrated. Stop-action images of a target have been obtained with computer microvision, microscopic interferometry, and stroboscopic illuminator. It can be developed for measuring the in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures.A new algorithm of sub-pixel step length correlation template matching is proposed to extract the in-plane displacement from vision images. Hariharan five-step phase-shift interferometry algorithm and unwrapping algorithms are adopted to measure the out-of-plane motions. It is demonstrated that the system can measure the motions of solder wetting in surface mount technology（SMT）.
基金
NationalNaturalScienceFoundationofChina(10474024and59971021)
关键词
光学测量系统
干涉测量法
表面技术
动态测量
Interferometry
Stroboscopic imaging
Computer microvision
Dynamic measurement
MEMS reliability
Solder wetting
