摘要
随着集成电路封装技术的发展,倒装芯片技术得到广泛应用。由于材料的热膨胀失配,使倒装焊点成为芯片封装中失效率最高的部位,而利用快捷又极具参考价值的有限元模拟法是研究焊点可靠性的重要手段之一。简单介绍了集成电路芯片焊点可靠性分析的有限元模拟法,重点概括了利用该方法对芯片焊点进行可靠性评价常见的材料性质和疲劳寿命预测模型。
As IC packaging technology developing, flip chip is widely used. Because of the coeffecient thermal efficent mismatch of material, the flip chip solder joint become the crispest position. And the swift, dependent finite element simulation is one of the practical means. The finite element simulation is introduced. Also there are some discusses about material behavior and fatigue model in solder joint life prediction.
出处
《电子工艺技术》
2006年第4期201-204,共4页
Electronics Process Technology
关键词
可靠性
有限元
热循环
应力/应变
疲劳寿命模型
Reliability
Finite element
Thermal cycling
Stress/strain
Fatigue life model
