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无铅焊接中Lift-off现象产生的原因及抑制对策 被引量：2

The Causes of and the Countermeasures Against the Lift-off Phenomenon Occured in Lead-Free Wave Soldering
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摘要 本文首次提出三要素法来解释Lift-off的形成机理。相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不含Bi的所有无铅钎料产生或不产生Lift-off的原因,并由此找出了Lift-off的抑制对策。 This paper puts forth the ＂three-factor method＂for the first time to explain the forming mechanism of lift-off. Compared with the traditional ＂Bi-Segregation＂ invalidation mechanism, the＂three-faetor method＂ can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth. Finally, the restraining countermeasures against lift-off are also given.
作者 李元山 陈旭
机构地区 国防科技大学计算机学院
出处 《计算机工程与科学》 CSCD 2006年第7期105-108,共4页 Computer Engineering & Science
关键词 无铅钎料 波峰焊 LIFT-OFF 三要素法 lead-free solders wave soldering lift-off,three-factor method
分类号 TG44 [金属学及工艺—焊接]
  • 相关文献

参考文献9

  • 1First European Lead-Free Soldering Technology Roadmap[EB/OL].http://www.lead-free.org,1998-07.
  • 2Second European Lead-Free Soldering Technology Roadmap[EB/OL].http://www,lead-free.org,2003-02.
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  • 9Thomas Siewert,Stephen Liu,David R Smith.Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0[Z].National Institute of Standards and Technology,2002.

同被引文献13

  • 1何鹏,赵智力,钱乙余.Sn-Bi-Ag-Cu钎料波峰焊焊点的剥离现象[J].中国有色金属学报,2005,15(7):993-999. 被引量：10
  • 2菅沼克昭.无铅焊接技术[M].宁晓山,译.北京:科学出版社,2004.
  • 3Vincent J H, Humpston G. Lead-free solders for electronic assembly[J]. GEC J Res, 1994( 11 ) : 76--89.
  • 4Jacobson D M, Hamson M R. Lead-free soldering: a progress report[J]. The GEC J Technol, 1997(14) : 98-- 109.
  • 5宣大荣.无铅技术应用参考标准介绍.表面贴装技术,1(5):24-24.
  • 6Suganuma K. Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J]. Scripta Materialia, 1998,138(9) : 1333--1340.
  • 7Williams C. NEMI's Lead-Free Assembly Project Reports Latest Results[A]. Proc of APEX'02[C]. 2002.
  • 8Bergman D W. NCMS Lead-Free Solder Project[J]. Journal of SMT, 2000.
  • 9Soldertec at Tin Technology Ltd. Second European Lead-free Soldering Technology Roadmap[EB/OL]. http://www. tintechnology. com, 2003-02.
  • 10Suganuma K. Current Lead-Free Soldering in Japan, ISIR, Osaka University[EB/OL]. http://www. nepss. org/presentations/SEMI_Europ/leadfreesolderingjapan. pdf, 2006-04.

引证文献2

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计算机工程与科学
2006年 第7期

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