摘要
We present a high-quality Ni/Ag/Pt Ohmic contact to p-type GaN. After the sample is annealed at 500℃ in 02 ambient for 3min, a specific contact resistance as low as 2.6 × 10^-5 Ωcm^2 and an optical reflectivity of 82% at 460 nm are obtained. The Auger electron spectroscopy analysis shows that the Pt layer can improve the surface morphology and thermal reliability of the annealed Ag-based electrode, Ag plays a key role in achieving good ohmic contact due to the outdiffusion of Ga into Ag forming Ga vacancies which increase the hole concentration, while the surface contamination of p-type GaN is reduced by Ni.
We present a high-quality Ni/Ag/Pt Ohmic contact to p-type GaN. After the sample is annealed at 500℃ in 02 ambient for 3min, a specific contact resistance as low as 2.6 × 10^-5 Ωcm^2 and an optical reflectivity of 82% at 460 nm are obtained. The Auger electron spectroscopy analysis shows that the Pt layer can improve the surface morphology and thermal reliability of the annealed Ag-based electrode, Ag plays a key role in achieving good ohmic contact due to the outdiffusion of Ga into Ag forming Ga vacancies which increase the hole concentration, while the surface contamination of p-type GaN is reduced by Ni.
基金
Supported by the National Natural Science Foundation of China under Grant Nos 60536020, 60390074, and 60536020, the Beijing Science and Technology Program （D0404003040321）, and the National High Technology Programme of China under Grant Nos 2001AA313130 and 2004AA31G060.
