单层圆片带引线元件的片式化实现

Chip Actualization of Single-layer Disc Components with Leads

介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。即将陶瓷芯片夹于上下连体扁平引线中间并焊接,模塑环氧树脂封装,再分割切开引线,使切开后的扁平引线贴在外壳表面,得到了用单层圆片制成的片式结构元件。已开发出CCH单层塑封型片式高压瓷介电容器、CCF单层塑封型片式交流瓷介电容器、ZVD单层塑封型片式氧化锌压敏电阻器产品,其结构坚固牢靠、防潮性能好、散热性能好、可靠性高,适应用于SMT生产。

It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs. First, the ceramic disc element was placed between the terminals of two tapes of joint-body leads, they were soldered, then the ceramic discs and the terminals were molded with epoxy resin. Secondly the terminals of the joint-body leads were cut separately, the cut leads were attached on the surface of molded body, then chip shape ceramic components were obtained. In this way, now chip molded high-voltage DC ceramic capacitors, chip molded AC ceramic capacitors and chip molded ZnO varistors are developed. These products have firm structure, good protection against the humidity, good dispersion of heat and excellent reliability, they can be used in SMT manufacture field.