新型大规模三维均匀低温等离子源理论及设计

Analysis and Design of a New Large Scale 3D Uniform Cold Plasma Source

给出了一种新型大规模三维均匀低温等离子源的工作原理、设计参数和具体实现方案。它使传统感应等离子源由二维均匀转变为三维均匀成为可能,为新型大规模集成芯片加工设备———等离子铣提供了必要的理论及技术准备。

A new large-scale 3D uniform cold plasma source is discussed in the paper. The principles, parameters and realization methods are presented. The design enables change from the 2 dimensions uniform TCP plasma source to 3 dimensions uniform plasma source. Such device provides a new feasible plasma source and denotes a new applied field for plasma in the industry of integrated chip manufactures.