摘要
通过CAE模流分析,在产品设计过程中预测可能出现的缺陷,对手机塑料壳体进行注塑分析和壁厚实验设计,优化了手机壳体的结构强度,提高手机设计的质量和效率。
Probable defect was predicted through CAE-based injection process analysis. In order to improve design quality and efficiency of mobile phone product, numerical simulation was applied for injection molding analysis and DOE technique was adopted for wall thickness experiment to optimize the structure strength of mobile phone housing.
出处
《模具技术》
2006年第4期40-43,共4页
Die and Mould Technology
关键词
手机
CAE
优化设计
mobile phone
CAE
optimization