摘要
用电化学阻抗法表征了铜表面上席夫碱自组装膜及其硫醇改进膜。研究结果表明,因席夫碱分子的刚性结构,使自组装膜中含有部分缺陷。用烷基硫醇进一步修饰席夫碱自组装膜后,表面覆盖度明显增加,而膜电容显著降低,说明膜质量得到了改善。
Self-assembled monolayers （SAMs） of Schiff bases were prepared on copper surface and characterized by electrochemical impedance spectroscopy （EIS）. The results showed that the SAMs of pure Schiff bases possessed some unfilled defect sites due to their rigid structure. A higher surface coverage and a lower film capacitance were obtained with a subsequent modification with alkanethiol, indicating a significant improvement in the quality of the films.
出处
《青岛科技大学学报（自然科学版）》
CAS
2006年第4期291-294,共4页
Journal of Qingdao University of Science and Technology:Natural Science Edition
关键词
席夫碱
自组装膜
电化学阻抗
Schiff bases
self-assembled monolayers
electrochemical impedance spectroscopy
