紫铜化学抛光的电化学研究

Electrochemical Studies on Chemical Polishing of Copper

测定了化学抛光过程中紫铜的表面光反射率、失重、表面形貌和电位随时间的变化以及抛光过程的电流－电位曲线。结果表明，紫铜的化学抛光过程由浸蚀，光亮和过腐蚀三个阶段组成。电抛光的钝化膜理论也同样适用于紫铜的化学抛光．

Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined.The results showed that chemical polishing was composed of the etching,polishing and pitting stage.The passivating film theory also applied to the chemical polishing.