摘要
对Al合金表面HCD法离子镀TiN膜进行了(透射电子显微镜)TEM观察分析。结果表明,镀膜表面由细小的TiN微晶组成,而其横截面上的TiN镀膜呈细柱状,间有微裂纹,镀膜与Al合金基体之间有—AlTi_2合金化合物过渡区域;同时,Al合金基体表面的原有择优取向发生变化,并与AlTi_3有一定的位向关系。
The surface and cross-sectional microstructures of TiN film on Al alloy have been observed by TEM. The surface of the film consists of TiN microcrystals. The cross-sectional microstructure is columnar and microcracks are found in the film. There is a transitive zone of AlTi_3 between TiN film and Al alloy substrate. There is a crystallographic relation [110]_(A_2Ti_3)||[123]_(A(?)).
关键词
铝合金
离子镀膜
TIN
HCD ion plating
TiN- film plated
Micrestructures of surface and cross-sectional film
Transitive zone
