摘要
采用金属铝诱导晶化非晶硅薄膜的方法制备多晶硅薄膜。研究了不同的退火温度对a-S i薄膜晶化的影响,采用XRD,R am an,SEM等测试手段分析了实验结果。实验结果发现非晶硅薄膜在400℃下退火20 m in薄膜仍为非晶结构(a-S i),在450℃下退火20 m in后非晶硅开始晶化且随着温度的升高,且晶化程度加强。
Amorphous silicon (a-Si) thin films were deposited on glass substrate by PECVD, and polycrystalline silicon (poly-Si) thin films were prepared by aluminum-induced crystallization (AIC). The effect of annealing temperature on the crystallization of a-Si films was investigated. The AIC poly-Si thin films were characterized by XRD, Raman and SEM, It was found that the a-Si film remains amorphous after annealing at 400℃ for 20min, but it begins to crystallize after annealing at 450℃ for 20min with its crystallinity improved obviously with increasing annealing temperature.
出处
《真空》
CAS
北大核心
2006年第4期16-18,共3页
Vacuum
基金
硅酸盐材料工程教育部重点实验室(武汉理工大学)开放课题基金资助项目(SYSJJ2005-12)
武汉理工大学校基金(2005XJJ054)
关键词
铝诱导晶化法(AlC)
非晶硅薄膜
多晶硅薄膜
aluminum-induced crystallization (AIC)
polycrystalline silicon thin film
amorphous silicon thin film