期刊文献+

陶瓷工艺品包装的力学建模和设计方法研究 被引量:4

Study on Mechanical Modeling and Design Method of Ceramic Artworks Packaging
下载PDF
导出
摘要 阐述陶瓷工艺品的特点,说明其包装的普遍性和重要性;应用动力学原理,给出包装的力学模型;根据力学模型,提出了采用“哈呋”结构的合理包装设计方案;从垂直跌落模拟试验和实际应用表明,该设计具有良好的缓冲性能和经济效益。 The characteristics of the ceramic artworks were introduced and the universality and essentiality was explained. Basing on the dynamics theory, the dynamics modeling of the packaging was given out, and the blue print of the packaging design named " Half" -structure was put forward. This packaging had a well cushion performance and a well economic benefit indicated by the simulated falling test.
出处 《包装工程》 CAS CSCD 北大核心 2006年第4期33-35,共3页 Packaging Engineering
关键词 陶瓷工艺品 力学模型 包装设计 方法研究 “哈呋”结构 ceramic artworks mechanical model packaging design designing wasy "Half" -structure
  • 相关文献

参考文献4

二级参考文献20

  • 1徐颢.机械强度可靠性设计[M].北京:机械工业出版社,1985.1-4.
  • 2谢勇 潘松年 宋宝丰.复杂激励条件下产品易损性评价方法的探讨[A].全.国第五届包装动力学与结构设计学术会议论文集[C].重庆,1994.130-135.
  • 3宋宝丰.产品脆值理论及应用[M].长沙:国防科技大学出版社,2002..
  • 45-Step Package Development. MTS System Corp. 1975.
  • 5H.H. Schueneman. Overpackaging: Unnecessary Evil That Can be Avoided. P.T. &E. 1996(10) :88-92.
  • 6W.R. Armstrong. Using Shock Response Spectra to Design Cushioned Packages. In: R.M. Fiedler, eds. Best of Transpack, IOPP,1996. 167-180.
  • 7R.E. Newton, Fragility Assessment Procedures, Theory and Test.MTS System Corp. Report 160,1968.
  • 8Hun Shen Ng. Design for standard impact pulses of drop tester using dynamic simulation, 2004 Electronics Packing Technology Conference ,2004 ;793 - 799.
  • 9Chwee - Teck Lim et al. Numerical simulation of the drop impact response of portable electronic product. IEEE Transactions on Components and Packing Technologies, 2002,25 ( 3 ) : 478 - 485.
  • 10E. H. Wong et al. Drop impact test - mechanics & physics of failure.2002 Electronics Packing Technology Conference,2002 ;327 - 333.

共引文献49

同被引文献21

引证文献4

二级引证文献7

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部