全自动IC芯片键合机的结构设计及原理

Design and Principle of the Mechanical Structure of the Automatic Die-bonder

键合是IC元件生产的重要封装过程或工序,需要在芯片键合机上完成。讨论了全自动IC芯片键合机的关键机械结构和原理,包括分片进料结构、送料结构、收料结构、芯片拾放装置的结构、顶针机构、晶圆供送装置等。

Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. It was discussed that the key mechanical structure and principle of the automatic Die-bonder, which includes the structures of lead-frame dispatch, transport, receiver, bonding head, needle, wafer feeder, etc.