摘要
介绍了环保型乙醛酸为还原剂的化学镀铜镀液的组成、各组分的作用和镀液中主要副产物的影响及处理方法,并介绍本公司近期的研究进展。
The solution of the electroless copper plating using nontoxic glyoxylic acid as the reducing agent is described in this article. The content includes the solution compounds, the function of the compounds and the effect of the main byproduct. Furthermore, the recent study of the solution from our company is introduced.
出处
《印制电路信息》
2006年第8期24-27,共4页
Printed Circuit Information
关键词
乙醛酸
化学镀铜
还原剂
glyoxylic acid electroless copper plating reducing agent
