摘要
概述了MacDermid利用电镀铜微盲导通孔填充工艺,可以防止焊接时的孔隙,洞生成和组装时的释气(爆孔),显著的改善了微盲导通孔填充的可靠性。
This paper describes the filling blind microvia process with electroplated-copper by Macdermid.It can prevent void formation in Solder joint and/or outgassing during assembly, and improves reliability of filling blind microvia markedly.
出处
《印制电路信息》
2006年第8期28-30,共3页
Printed Circuit Information
关键词
微盲导通孔
电镀铜
导通孔填充
抑制剂及抑制剂
blind microvia electroplated-copper via filling suppressor anti-suppressor
