摘要
概述了高弯曲性层压型基材——NFX系列的开发,它的特征在于高弯曲性和低刚性,它是FPC用薄型高弯曲性2层FCCL。
This paper describes the development of high deflection laminate type base material NFX Series.NFX series is characteristic of high deflection and low stiffness.HFXseries is tin type and high deflection two layer FCCL for FPC.
出处
《印制电路信息》
2006年第8期41-44,54,共5页
Printed Circuit Information
关键词
2层挠性覆铜板(2层FCCL
全部聚酰亚胺覆铜板)
高弯曲性
低刚性
two layer flexible copper clad laminate （two layer FCCL, all polyimide coppper clad laminate） high deflection low stiffness
