摘要
利用闪光对焊的方法对所制备的SiCP/3003Al复合材料进行焊接,并对不同SiCP增强相体积分数的复合材料的接头强度和显微组织进行了分析。结果表明,接头的强度和焊缝区碳化硅颗粒富集带的宽度,均随着母材中碳化硅颗粒含量的增加而增加。
SiCp/3003Al composite material was welded by using flash butt welding method,and the strength and microstructure of the material joints of different SiCp strengthen-phase content were analyzed, The results show that both the strength and width of SiCp enrichment-zone of the joints increase with the SiCp content rising in basing metal.
出处
《热加工工艺》
CSCD
北大核心
2006年第15期12-13,共2页
Hot Working Technology
关键词
闪光对焊
复合材料
增强相
强度
显微组织
flash butt welding
composite material
strengthen-phase
strength
microstructure
