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通孔对金属连线温度分布的影响

Effects of Via on Temperature Distribution of Metal Wires
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摘要 详细讨论了考虑通孔自热的金属连线温度分布模型,并通过该模型,计算了不同通孔直径和高度情况下,单一及并行金属连线的温度分布。计算结果表明,通孔直径和通孔高度及并行金属连线间的热耦合对金属连线温度分布有重大的影响。 An analytical thermal model considering via self-heating is presented for estimating the temperature of metal wires. Using this model, effects of via diameter and via height on both single and parallel lines are calculated. It has been shown that via diameter, via height or thermal coupling has significant effects on the temperature distri- bution of metal wires.
作者 裴颂伟 黄河 何旭曙 鲍苏苏
机构地区 华南师范大学计算机学院
出处 《微电子学》 CAS CSCD 北大核心 2006年第4期385-388,共4页 Microelectronics
基金 国家自然科学基金资助项目(60076013)
关键词 集成电路 通孔 金属连线 温度分布模型 通孔自热 通孔直径 通孔高度 Integrated circuit Via Metal wire Via self-heating Via diameter Via height
分类号 TN432 [电子电信—微电子学与固体电子学] TN47 [电子电信—微电子学与固体电子学]
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参考文献9

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二级参考文献8

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微电子学
2006年 第4期

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