摘要
介绍一种特别的双向可控硅芯片的结构,该结构在芯片正面和背面均采用台面玻璃钝化工艺保护PN结终端以获得可靠的正反向阻断特性。描述了芯片的内部结构和制造工艺流程,并对封装过程中存在的主要问题和解决办法进行了分析和讨论。
A special triac structure is introduced in this paper. Glass passivation technology is applied in protecting the PN -junction terminals of the triac die on both of the front and back surface. The structure and fabricating technology of the triac die is introduced,and the packaging problem is discussed too.
出处
《现代电子技术》
2006年第16期156-157,共2页
Modern Electronics Technique
关键词
结构
玻璃钝化
PN结
封装
structure
glass - passivation
PN - junction
packaging
