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Nano ZrO_(2) Particulate-reinforced Lead-Free Solder Composite 被引量:1

Nano ZrO_2 Particulate-reinforced Lead-Free Solder Composite
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摘要 A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstrucrural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size of β-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the HalI-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders. A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstrucrural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size of β-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the HalI-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第4期529-532,共4页 材料科学技术(英文版)
基金 The authors are grateful to the National Natural Science Foundation of China (No. 50401033) FANEDD of China (No. 200335) the Natural Science Foundation of Tianjin City (No. 033608811) Fok Ying Tong Education Foundation (No. 104015) for grant and financial support.
关键词 ZrO2 nanopowders Microstructure Composite solder MICROHARDNESS ZrO2 nanopowders Microstructure Composite solder Microhardness
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参考文献18

  • 1[1]M.Abtewa and G.Selvadurayb:Mater.Sci.Eng.,2000,R27,95.
  • 2[2]K.Zeng and K.N.Tu:Mater.Sci.Eng.,2002,R238,55.
  • 3[3]C.M.L.Wu,D.Q.Yu,C.M.T.Law and L.Wang:Mater.Sci.Eng.,2004,R44,1.
  • 4[4]K.W.Moon,W.J.Boetinger,U.R.Kattner,F.S.Biancaniello and C.A.Handwerker:J.Electron.Mater.,2000,29,1122.
  • 5[5]D.Q.Yu,J.Zhao and L.Wang:J.Alloy.Compd.,2004,376,170.
  • 6[6]C.M.L.Wu,D.Q.Yu,C.M.T.Law and L.Wang:J.Mater.Res.,2002,17,12.
  • 7[7]L.Wang,D.Q.Yu,J.Zhao and M.L.Huang:Mater.Let.,2002,56,1039.
  • 8[8]S.K.Kang,D.Y.Shih,D.Leonard,D.W.Henderson,T.Gosselin,S.Cho,J.Yu and W.K.Choi:JOM,2004,56,6.
  • 9[9]J.L.Marshall,J.Calderon,J.Sees,G.Lucey and J.S.Hwang:Composite Solders,IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1991,14,698.
  • 10[10]J.L.Marshall and J.Calderon:Soldering & Surface Mount Technology,1997,26,22.

同被引文献44

  • 1ZHANG L,TU K N.Structure and properties of lead-free solders bearing micro and nano particles[R].Materials Science&Engineering:R:Reports,2014:82:1-32.
  • 2TIAN Y H,LIU W,AN R,et al.Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu leadfree solder joints during in situ tensile test[J].Journal of Materials Science:Materials in Electronics,2012,23(1):136-147.
  • 3ZHANG L,XUE S B,GAO L L,et al.Effects of rare earths on properties and microstructures of lead-free solder alloys[J].Journal of Materials Science:Materials in Electronics,2009,20(8):685-694.
  • 4CHENG Z G,SHI Y W,XIA Z D,et al.Properties of lead-free solder Sn Ag Cu containing minute amounts of rare earth[J].Journal of Electronic Materials,2003,32(4):235-243.
  • 5GAO L L,XUE S B,ZHANG L,et al.Effect of praseodymium on the microstructure and properties of Sn3.8-Ag0.7Cu solder[J].Journal of Materials Science:Materials in Electronics,2010,21(9):910-916.
  • 6ZHANG L,HAN J G,HE C W,et al.Properties of Sn Zn lead free solders bearing rare earth Y[J].Science and Technology of Welding&Joining,2012,17(5):424-428.
  • 7WU C M L,YU D Q,LAW C M T,et al.Properties of lead-free solder alloys with rare earth element additions[J].Materials Science and Engineering R,2004,44(1):1-44.
  • 8DUDEK M A,CHAWLA N.Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders[J].Acta Materialia,2009,57(15):4588-4599.
  • 9ZENG G,XUE S B,GAO L L,et al.Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition[J].Journal of Alloys and Compounds,2011,509(25):7152-7161.
  • 10CHUANG T H,YEN S F.Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array packkage[J].Journal of Electronic Materials,2006,35(8):1621-1627.

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