摘要
环氧塑封料(Epoxy Molding Compound)是一种半导体封装用电子材料,主要应用于半导体器件和集成电路芯片的封装。文章主要是通过对环氧塑封料的发展历程、典型技术和制造工艺,以及国内外发展状况和市场应用等方面的研究,对全球的环氧塑封料的发展状况进行浅析。文章特别提到有关绿色环保塑封料的应用情况。
Epoxy Molding Compound （ EMC ） is a kind of electronic material applied in the package of semiconductor apparatus and IC chip. This paper is mainly studying the development status of Epoxy Molding Compound by the development course and the typical technology and the manufacture craftwork and the development status of all the world and the marketing application of EMC, and so on. In addition, Green Epoxy Molding Compound is refered specially in this paper.
出处
《电子与封装》
2006年第8期6-9,共4页
Electronics & Packaging
