摘要
文中从焊接组装的基本要求出发,比较了“无铅”组装和传统工艺的主要差异。回顾、分析了无铅焊料、元器件及工艺等相关因素对质量和产品可靠性的影响。讨论了常见的组装缺陷和电迁移现象产生的原因及其预防措施。
This paper introduce basic requirements of assembly. It compares the major difference between Lead_free assembly and traditional process. Reviews and analyses some relative factors which influence on products quality and reliability, such as Lead free Solder, components, and process. Discuss some assembly defects and migration for causes and orecaution
出处
《电子与封装》
2006年第8期18-22,32,共6页
Electronics & Packaging
关键词
无铅组装
可靠性
焊料
元器件
工艺
缺陷
电迁移
lead-free assembly technoligy
reliability
solder
components
process
defects
migration
