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硅基GaN蓝光LED外延材料转移前后性能 被引量:1

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摘要 利用外延片焊接技术,把Si(111)衬底上生长的GaN蓝光LED外延材料压焊到新的Si衬底上.在去除原Si衬底和外延材料中缓冲层后,制备了垂直结构GaN蓝光LED.与外延材料未转移的同侧结构相比,转移后的垂直结构GaN蓝光LED的电学性能、发光性能和结构性能明显改善,光输出功率显著提高.垂直结构LED的GaN层受到的张应力比同侧结构LED小.
出处 《中国科学(E辑)》 CSCD 北大核心 2006年第7期733-740,共8页 Science in China(Series E)
基金 国家863计划 信息产业部电子发展基金 南昌大学校基金资助项目
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