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CuPc/SiO_2表面界面的电子状态研究(英文)

AFM and XPS Study on the Surface and Interface States of CuPc and SiO_2 Films
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摘要 利用热生长工艺和热蒸发方法分别获得CuPc和Si O2薄膜层,通过原子力显微镜和X射线光电子能谱对其表面界面电子状态进行了研究,并采用高斯拟合方法对各谱进行了详细分析.结果表明,在氧原子的作用下,N1s ,C1s ,O1s和Cu2p都经受了一定的化学位移,从而使得各原子间的相互作用强度有所改变,这是导致OFET性能劣化的重要原因之一.对OFET而言,采用溅射工艺制备的Si O2层应比热氧化生长的Si O2层更合适. A CuPc/SiO2 sample is fabricated. Its morphology is characterized by atomic force microscopy, and the electron states are investigated by X-ray photoelectron spectroscopy. In order to investigate these spectra in detail, all of these spectra are normalized to the height of the most intense peak,and each component is fitted with a single Gaussian function. Analysis shows that the O element has great bearing on the electron states and that SiO2 layers produced by spurting technology are better than those produced by oxidation technology.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第8期1360-1366,共7页 半导体学报(英文版)
关键词 CuPc/SiO2 X射线光电子能谱 表面界面分析 CuPc/SiO2 X-ray photoelectron spectroscopy surface and interface analysis
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