超声波振动激励下焊点失效分析与改进

FAILURE ANALYSIS AND IMPROVEMENT OF SOLDER JOINT UNDER ULTRASONIC VIBRATION

为了解决管脚焊点在超声波焊接后出现的失效问题,研究用数值仿真的方法来进行建模分析,并提出改进方法。根据超声波能量转化形式,简化焊接系统模型,提出适合仿真的加载方法和边界条件,并根据热-力耦合仿真的温度场结果分析模型的可行性。针对具体的手机电池产品,建立超声波焊接系统整体三维有限元模型,利用仿真结果分析失效原因,提出减振措施并做实验验证。

A new method of simulation and improvement is proposed to solve the problem that a solder joint often fails due to vibration of ultrasonic welding.According to transforming mechanism of energy transmission,the complex welding system and boundary conditions are simplified for explicit finite element simulation,which is verified by the joint temperature distribution calculated using the thermo-mechanical coupled model.Then,based on certain type of cell phone battery,a 3 dimensional finite element model for the ultrasonic welding system is established for analyzing its vibration during welding,and the structure improvement is also conducted in terms of the simulation result.The experiments prove its favorable effect.