期刊文献+

压电薄膜微传感器振动模态的仿真分析 被引量:16

THE VIBRATION MODAL ANALYSIS OF PIEZOELECTRIC THIN FILM MICROSENSOR
下载PDF
导出
摘要 以压电本构方程为基础,建立了压电薄膜微传感器机电耦合的有限元模型,采用有限元分析软件ANSYS7.0对压电薄膜微传感器进行了模态分析,同时分析了压电薄膜微传感器的结构尺寸对振动模态的影响,探讨了影响压电薄膜微传感器工作稳定性和响应速度的关键因素,结果表明为了提高压电薄膜微传感器的工作稳定性和响应速度,应该在符合工艺要求和保证其它特性的前提下,尽量减小微悬臂梁结构长度,增加多晶硅层厚度,限制PZT层厚度,而微悬臂梁宽度的影响较小。 Based on piezoelectric constitutive equation,a finite element model of piezoelectric thin film microsensor is established.By using the finite element software ANSYS7.0,its modal analysis is implemented,and the influence of structural size of piezoelectric thin film microsensor on vibration modes are analyzed,and some key factors that have an effect on the performance of this microsensor are explored.These results indicate that in order to improve work stability and response speed of piezoelectric thim film microsensor we should minimize the length of micro-cantilever beam structure,increase the thickness of polysilicon layer and restrict the thickness of PZT layer with the prerequisite for satisfying technical requirements and ensuring other characteristics,but the influence of width of micro-cantilever beam is less.
出处 《振动与冲击》 EI CSCD 北大核心 2006年第4期165-169,共5页 Journal of Vibration and Shock
基金 国家自然科学基金资助项目(90207022) 武器装备预研基金项目(51411040105DZ0141)
关键词 压电薄膜 有限元分析 耦合场 微传感器 模态分析 piezoelectric thin film,finite element analysis(FEA),coupling field,microsensor,modal analysis
  • 相关文献

参考文献10

  • 1杨银堂.基于硅集成化工艺的铁电薄膜微机械基础研究:[博士学位论文][D].西安:西安交通大学,2000:21-24
  • 2林声和,王裕斌.压电陶瓷[M].北京:国防工业出版社,1980:17~20.
  • 3Allik H,Hughes J R.Finite element for piezoelectric vibration[J].International Journal Numerical Method of Engineering,1970,2:151-157
  • 4Sung Yi,Shih Fuling,Ming Ying.Larger deformation finite element analyses of composite structrures integrated with piezoelectric sensors and actuators[J].Finite Element in Analysis and Design,2000,35:1 -15
  • 5Veijola T.Large-displacement modeling and simulation of micro-electromechenical electro-statically driven resonators using the harmonic balance method[J],IEEE MIT-S int.Microwave Symp.Sig.,Boston,MA,pp.99-102,June 2000
  • 6ANSYS User's Manual,vol.1 procedures,ANSYS,Houston,PA,1992
  • 7Flavitis F D,Coccioli R.Combined mechanical and electrical analysis of microelectomechanical switch for RF applications[J],presented at European Microwave Conference EUMC 1999,Munich,German,1999
  • 8Julian W.Gardner,Vijay k.Varadan,Osama O.Auadelkarin.Microsensors,MEMS,and Smart Devices[M].England.John Wiley & sons.Ltd.2002:462
  • 9Piezoelectric Technology Data for Designers[M],Morgan Matroc Inc.,Electro Ceramics Division,14
  • 10ANSYS Coupled-Field Analysis Guide,Release 5.5,ANSYS Inc.,September 1998,pp.3-3 though 3-6

共引文献7

同被引文献58

引证文献16

二级引证文献124

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部