期刊文献+

低能量Ar^+背面轰击对晶体管特性的影响 被引量:2

Effect of Low Energy Ar ̄+ Backsurface Bombardent on Bipolar Junction Transistor Characteristics
下载PDF
导出
摘要 在完成硅平面晶体管管芯和上部电极制备后,用低能量氩离子束进行背面轰击,能显著增大高频和超高频小功率晶体管的电流放大系数,提高特征频率、功率增益和输入阻抗,减小噪声系数和使击穿特性变硬,而势垒电容和薄层电阻不改变.实验结果和理论分析表明,上述参数的改善与轰击后界面态密度的减小、少数载流子寿命和扩散系数的增大有关. Abstract The low energy argon ion beam has been used to bombard directly the backside of bipolar junction transistors at room temperature, and the characteristics of the transistors can be effectively improved. After the bombardment of transistor, the current gain,characteristic frequency, power gain and input impedance increase obviously, the noise factor decreases, and the electrical breakdown characteristics are improved. The effects are relevant to the bombardent time and beam current density. The results and analys is s0how that the improvement of transistor characteristics is relevant to the decreasing of in terface state density at Si-SiO2 interface, and the increasing of minority carrier lifetime and diffusion constant.PACC: 7850, 8160, 7300
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1996年第6期465-469,共5页 半导体学报(英文版)
  • 相关文献

参考文献4

  • 1陈畅生.硅中吸除技术的物理机制[J].Journal of Semiconductors,1992,13(3):174-180. 被引量:10
  • 2蒋荣华,梁李成,肖顺珍.硅吸除技术[J].半导体光电,1990,11(3):289-296. 被引量:1
  • 3齐建华,李树荣.层注入吸除二极管阵列的杂质及其分析[J]半导体技术,1988(01).
  • 4潘姬,齐建华,赵鸿麟,汪一沙,王春亮.Ar~+注入吸杂效应与剂量的关系[J]半导体学报,1985(03).

二级参考文献3

  • 1陈畅生,武汉大学学报,1991年,1期,29页
  • 2Kang J S,J Appl Phys,1989年,65卷,2974页
  • 3Hu S M,J Appl Phys,1974年,45卷,1567页

共引文献9

同被引文献4

引证文献2

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部