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动圈式扬声器温度失效仿真 被引量:2

Study on a Typical Temperature Failure Model for Loudspeaker
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摘要 常态下测量了典型小功率动圈式扬声器的静态参数,根据Small小信号参数建立了扬声器温度失效模型;结合VisualC++和Matlab计算机语言的优势,编制了相应的仿真软件;对给定动圈式扬声器中可能出现的音圈短路、功率过载和意外结构性故障进行了计算机仿真,结果表明,封闭工作区间内温度急剧升高是导致扬声器失效的主要原因,与有限元模型计算结果相比较,最大误差分别为2.63%(16W,纸骨架)和3.36%(16W,铝骨架)。 Static parameters of typical low power loudspeaker are measured in the normal condition. Loudspeaker failure model is established based on Small's low signal parameters. Taking the advantage of Visual C++ and Matlab a simul-ating software is prog-ramed. The movements of loudspeaker temperature which result from short circuit, overloading and unexp ected faults are simulated. The simulating results show that an acute high of loudspeaker temperature is the dominant reason of failure. Compareed with the calculating results of finite element analysis, there are an error of 2.63% (16 W, paper frame) and an error of 3.36% (16W, aluminium frame).
出处 《电声技术》 2006年第8期23-25,共3页 Audio Engineering
关键词 动圈 扬声器 热失效模型 计算机仿真 moving coil loudspeaker thermal failure model computer simulation
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二级参考文献9

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共引文献8

同被引文献28

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