摘要
超级CSP是利用晶圆级封装技术工艺在芯片上用高可靠密封剂安装插板装配的新密封工艺技术。它能够使封装结构成为真正的芯片尺寸型封装(KGED)。介绍了超级CSP具有良好的板级可靠性的原因:密封剂的C.T.E接近于母板的C.T.E、密封剂的高粘附强度、焊球和端子连接部分坚固的结构。
SuperCSP is fabricated by building up the interposer with high reliable encapsulant on the chip by wafer level packaging technology. New encapsulation technology enables real chip-sized package from package perspective. It is also a known good encapsulated die (KGED) from die perspective. The reasons why board level reliability of SuperCSP is good are as follows: The C.T.E.of encapsulant for SuperCSP is close to that of motherboard, encapsulant with high adhesive strength and connecting portion of solder ball and post has a strong structure.
出处
《电子工业专用设备》
2006年第8期18-22,共5页
Equipment for Electronic Products Manufacturing