Al-Ni超声楔焊中输入功率与界面键合的特征分析

Analysis on characteristics of input power and interface wedge bonding of Al-Ni ultrasonic aluminum wedge bonds

为了研究超声键合中在超声能量作用下金属间形成键合界面而构成键合力的机理,确定金属间吸收的超声能量与形成的界面质量的关系,在超声楔焊键合试验中,对A l-N i楔焊通过改变焊接参数而获得完全键合和半键合的界面,并对其界面特征进行扫描电镜测试分析;同时,利用示波器采集超声键合机焊接时的电信号,分析了PZT驱动的输入阻抗和功率特性,并与界面质量对比.研究结果表明:超声键合而形成的A l-N i界面为中央未键合的椭圆界面;相同参数条件下,一焊输入阻抗和吸收功率大于二焊,一焊的界面质量也高于二焊.

This paper aims to do research on the mechanism of the force of wedge bonds formed by the interface of wedge bonds based on the ultrasonic energy of metals in ultrasonic wedge bonds and the relationship between the absorbed ultrasonic energy among metals and the interface quality. A series of experiments of microstructure wedge bonding are carried out to test and analyze Al- Ni interface and semi-interface of wedge bonds by KYKY 2800. At the same time, the driving electric signal of the wedge bonder at bonding, which is measured by Digital Oscilloscope, is used to analyze the characteristics of input impedance and the power of PZT transducer which were then compared with the interface quality. Results show that the pattern of partially bonded material at the Al - Ni interface of ultrasonic wedge bonds looks like an ellipse without wedge bonding at the center, and that the input impedance and the transforming power of the first wedge bond, for the same machine variables, are greater than that of the second wedge bond, and its characteristics is superior to the second one.