摘要
为检测SMT片式元件焊点的质量,减少研究过程中制作实际光源的成本,方便观察各个角度下的焊点形态,研究了仿真光源检测办法。通过建立SMT片式元件焊点模型,比较确定条件下仿真光源和实际光源的效果,确定最佳光照模型。通过改变仿真光源的位置,确定最佳仿真光源的光照位置,从而确定最佳实际光源光照位置。该研究通过Surface Evolver软件建立各种SMT片式元件焊点模型,并通过OPENGL编程完成SMT片式元件焊点模型的转化和光源的仿真过程,该研究对SMT片式元件焊点的检测研究起到优化光源位置结构的作用,对SMT片式元件焊点后期检测提供了坚实基础。
For inspecting solder joint quality and reliability and decreasing cost in the course of Study in solder joint detect, this paper establish simulation system of lighting effect of SMT solder Joint. It also establish SMT solder joint model via Surface Evolver. After that, software is programmed in .NET and Opengl and finish simulat ion process.This paper optimize lighting position and provide useful condition for inspecting solder joint quality and reliability.
出处
《现代表面贴装资讯》
2006年第4期72-76,共5页
Modern Surface Mounting Technology Information