高速系统PCB设计中的几个关键问题

The Key Problems in High Speed Systems PCB Design

随着微电子技术的飞速发展,高速大规模集成电路的广泛应用,高速系统的设计也越来越受到重视,高速系统与低速系统的PCB设计有很大不同。本文从实际设计的角度介绍了高速系统中电源、接地、时钟电路、过孔等的设计和需要注意的问题。

With the development of micro - electronics technique, and the application of VLSI,the design methods of high speed systems becomes more and more important. There are many differences in PCB desigtt between high speed systems and low speed systems, such as power,grounding ,clock circuit ,impedance matching ,via and ＂zero＂ capacitor. In this paper we will introduce these issues and also introduce the problems must be pay attention to.