化学镀锡反应历程的研究进展

Research process on electroless tin plating reaction mechanism

化学镀锡主要包括还原法化学镀锡、歧化反应化学镀锡和浸镀法化学镀锡,总结了3种方法的优缺点及反应机理。还原法化学镀锡和歧化反应化学镀锡的镀液稳定性差;浸镀法化学镀锡的镀液稳定性好,镀层厚度均匀,其沉积过程分为置换反应期、铜锡共沉积与自催化沉积共存期和自催化沉积期。化学镀锡工艺在微电子行业具有很好的应用前景。

The methods of electroless tin plating include processes based on reduction, disproportionation and replacement reactions. The advantages and disadvantages and reaction mechanisms of the above methods were summarized. The plating baths based on reduction and disproportionation reactions have poor stability while the replacement-based bath is stable, and the deposit has uniform thickness. The deposition process with replacement reaction includes replacement reaction period, copper-tin codeposition and autocatalytic deposition coexisting period, autocatalytic deposition period. The process of electroless tin plating has wide applications in microelectronic filed.