摘要
研究了添加微量稀土Y对Sn3．8Ag0．7Cu钎料合金显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuY合金是性能优良的无铅钎料合金,同时确定了最佳的Y含量范围。
In the present paper the effect of trace amount rare earth Y on the microstructure and the performance of Sn3.8Ag0.7Cu solder alloy has been systematically investigated Through measurement of melting temperature, wettability and joint shear strength, and observation of microstructure, it is indicated that the SnAgCuY ahoy containing rare earth Y is a lead-free solder with excellent performances. At the same time the best content of Y was determined.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2006年第A02期121-123,共3页
Rare Metal Materials and Engineering
基金
国家863高技术项目资助(No.2002AA322040)
