硅压力传感器芯片设计分析与优化设计

Analysis and Optimal Design of Silicon Piezoresistive Pressure Sensor Chip

用弹性力学和板壳力学理论分析了半导体硅压阻式压力传感器方形膜片的受力分布,为力敏电阻在应变膜上的布置提供依据;利用有限元分析方法和借助ANSYS仿真软件,对微型硅压阻式高温压力传感器应变膜进行了一系列的分析和计算机模拟,探讨了传感器方形应变膜简化应力模型的合理性以及温度对应力差分布的影响,得到了直观可靠的结果。

Stress distribution of the semiconductor square thin diaphragm is deduced by the theory of elastic mechanics and the theory of plates and shells, it provided reference for the disposition of sensing resister in strain membrane. A series of micro silicon piezoresistive pressure sensor chips were analysed and simulated using ANSYS software on the account of finite-element analysis （FEA） theory. The distribution of the difference between stresses of sensor strain membrane is demonstrated, and reliable result was achieved.