印制板用的耐热性环氧—硅复合树脂基材

Heat-Resistant Epoxy-Silicon Hybrid Materials for Printed Circuit Boards

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摘要概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。 This paper describes the development of the epoxy-silicon hybrid resin based on a new concept.It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.

作者蔡积庆

出处《印制电路信息》 2006年第9期23-27,共5页 Printed Circuit Information

关键词覆铜箔板环氧-硅复合树脂耐热性基材无铅焊料溶胶-凝胶反应 copper-clad laminate epoxy-silicon hybrid resin heat-resistant material Pb-free solder sol-gel reaction

分类号 TN41 [电子电信—微电子学与固体电子学]

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印制电路信息

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印制板用的耐热性环氧—硅复合树脂基材

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