HDI激光成孔技术

Hole Formation Technology by Laser Shooting on HDI

随着PCB制作技术的高速发展,HDI基板布线密度与孔径分布日趋精密化、微型化,顺应HDI成孔加工技术需要,激光成孔技术在国内得到广泛应用。本文针对我国HDI市场生产需要,从目前各HDI厂商所采用的HDI技术入手,阐述了目前HDI生产中所使用的激光钻孔技术,并就其激光戍孔原理、戍孔技术特征、工艺特性及加工过程等方面进行了分析、对比与探讨。

Along with rapid progress of manufacturing technology on PCB, it is getting more and more precise and miniature for the circuit layout density and hole-diameter on HDI board so that it can conform a new hole formation technology by laser shooting to meet machining requirement of HDI; and this new technology obtains abroad application in the nation. Starting with demand of HDI producing in our country and HDI technique adopted by all manufacturers of PCB now, it is set forth for hole formation techniques in existence by laser shooting in this paper, then its principle, techno-character, craft-peculiarity and machining process etc are analyzed, compared and discussed.