摘要
概述了挠性和刚-挠性板的前处理工艺。等离子态去钻污费时和成本高,采用改进的前处理的化学镀铜可以满足挠性印制电路(FPC)大生产的要求。
This paper describes the pre-treatment process of flex and rigid-flex.Due to the time and expense of using plasma desmear there is a lot ofpre-treatment to generate a suitable electroless copper solution for FPC mass production.
出处
《印制电路信息》
2006年第9期43-47,共5页
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