聚四氟乙烯多层微带板制造工艺探索

Study on the Process Technology of the Preparation of the Multilayer Microstrip Circuit Board

本文对一种玻璃微纤维增强聚四氟乙烯高频介质材料，制造通讯用多层微带板的工艺流程，进行了简单的介绍，对所选用的制造工艺技术进行了较为详细的论述。

The fabrication of the multilayer microstrip circuit board of the glass microfiber reinforced polytetrafluoetylene composite applied for communication was briefly introduced. The manufacturing process technology was also illuminated.